High Speed Circuit Designer, Quantum AI at Google in Goleta, CA, USA

Job description

• Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
• In this role, you will be a key team member in the development of quantum control and measurement systems. You will leverage radio frequency (RF), analog, or mixed-signal expertise to implement high-performance board-level designs which are then used to control our quantum computers.
• You will work with ASIC designers to architect system-level solutions which allow us to improve our system density and performance. You will document your designs and measurement results and present these data to relevant stakeholders. You will support team-members using the equipment you have designed as they integrate it into larger quantum computing systems.
• The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.
• Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
• US: $159000 - $230000 (USD) + 15% bonus target + equity + benefits
• Learn more about benefits at Google.

Responsibilities

• Support deployment and operations of electronics to Google’s fleet of quantum computers.
• Contribute to the design of control and measurement systems for next generation quantum computers, from architecture through implementation and deployment.
• Drive board-level projects of high complexity to completion, collaborating with team of engineers.
• Document work and share result with relevant stakeholders.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
• 3 years of experience in analog, digital, or mixed-signal design.
• 3 years of experience designing printed circuit boards (PCBs) containing GHz-rate data converters, field-programmable gate arrays (FPGAs), or processors.
• Master's or PhD degree in Electrical Engineering, Computer Engineering, Physics, or a related field.
• Experience in multiple electrical engineering design disciplines (e.g., FPGA, AMS, or RF at the board and, possibly, chip level), including specification discovery to system deployment.
• Experience leading development projects, including successful system deployments.
• Experience with vendor management.
• Experience with packaging and signal integrity/power integrity (SI/PI) tools.
• Understanding of industry board-level design practices across relevant disciplines (analog/mixed-Signal (AMS), RF, FPGA, etc.), including relevant design tools.

Skills

Required

• Analog, digital, or mixed-signal design
• Printed circuit board (PCB) design
• GHz-rate data converters
• Field-programmable gate arrays (FPGAs)
• Processors

Preferred

• Leading development projects
• Vendor management
• Industry board-level design practices